Core Technology





　

Foaming Technology



INOAC has been developing foams manufactured from various materials,

such as rubber and plastic, since it became the first company in JAPAN 

to start production of urethane foam. The manufacturingmethod 

                                                      employed by INOAC makes use of various processes such as extraction, 

                                                      chemical foaming, gas mixing, chemical reactions and evaporation to 

                                                      supply original foams for specific applications and materials











Surface Treatment Technology



Giving multiple functions to one component enables cost reduction, 

more compact products, and advanced functions. INOAC has a wide

range of surface treatment technologies. For example, coating the 

                                                      surface of a non-skid elastic material allows slick elastic sealing 

                                                      INOAC has also developed a roller with high precision and high 

                                                      resistance by applying a special high-precision coating technique to 

                                                      a metal shaft  and by adding a swinging function.











Advanced Elastomer Technology



Elastomer has attracted a lot of attention not only for its functions, 

but also from environmental and recycling perspectives. INOAC offers 

advanced elastomer based on its development capabilities and 

                                                      high-level molding technology for rollers, and sealing 

                                                      materials with conductivity functions added













Thin-molding Technology



Thin-molding is a technology that gives metal-like rigidity and strength 

to a soft, lightweight resin. For example, INOAC has a technology that 

uses carbon fiber with a resin to increase strength and to mold it into 

                                                       products less than 1mm thick.This technology meets growing demand 

                                                       for stronger, thinner, and smaller equipment, including note PC's and 

                                                       portable terminals.













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